Industrial Design & Mechanical Engineering
What is Industrial Design for Electronics?
Industrial Design for Electronics merges aesthetics with rugged engineering. It involves creating functional enclosures that manage thermal dissipation (CFD), ensure EMC shielding, and provide IP67/68 ingress protection. This approach ensures hardware reliability in harsh environments while complying with the EU Ecodesign Regulation.
We design the physical reality of your electronic product. From thermal management of high-power FPGAs to IP68 ruggedized enclosures for defense — ensuring your hardware survives the real world.
Mechanical Engineering for Electronics
Electronics do not exist in a vacuum. They generate heat, emit EMI, and face vibration. Our mechanical engineers work alongside PCB designers in Altium + SolidWorks co-design workflows to ensure fit, function, and manufacturability from day one.
- Thermal Simulation (CFD): Active and passive cooling strategies for Edge AI nodes and high-performance FPGA computing. We simulate airflow and heat dissipation before cutting metal.
- EMC Shielding: Custom machined aluminum housings and conductive gaskets to meet EN 55032 Class B emission standards.
- Ruggedization: Shock and vibration damping for MIL-STD-810H defense compliance.
DFM & Tooling Management
A beautiful render is useless if it cannot be manufactured. We bridge the gap between industrial design and the injection molding factory.
- Design for Manufacture (DFM): Draft angle analysis, wall thickness optimization, and snap-fit engineering to maximize yield and minimize cycle time.
- Mold Flow Analysis: Preventing sink marks, weld lines, and warpage in plastic parts.
- Tooling Oversight: We manage the entire tooling process (T0/T1/T2 trials) with our EU or vetted global partners, ensuring the final part matches the CAD file.
Sustainability & Ecodesign
Aligned with the EU Ecodesign for Sustainable Products Regulation (ESPR), we design for repairability and recyclability.
- Right-to-Repair: Enclosures designed for non-destructive opening (screws not glue).
- Material Selection: PC/ABS, Aluminum 6061, and bio-composites with full material traceability.
- Digital Product Passport: Mechanical integration of QR/NFC tags for lifecycle tracking.
Capabilities
| Domain | Specification |
|---|---|
| CAD Software | SolidWorks, Autodesk Fusion 360, Rhino |
| Ingress Protection | IP65, IP67, IP68 (Submersible) |
| Impact Protection | IK08 to IK10 (Vandal resistant) |
| Materials | Injection Molded Plastics, CNC Aluminum, Sheet Metal, 3D Print (SLA/SLS) |
| Compliance | RoHS, REACH, WEEE, Ecodesign |
“The enclosure is the first thing your customer touches. It must convey the quality of the engineering inside.”
Frequently Asked Questions
What is industrial design for electronics?
Industrial design for electronics merges aesthetics with rugged engineering — creating functional enclosures that manage thermal dissipation (via CFD simulation), ensure EMC shielding, and provide IP67/68 ingress protection. It ensures hardware reliability in harsh environments while complying with the EU Ecodesign Regulation (ESPR).
What does IP67 and IP68 mean?
IP67 means the enclosure is dust-tight and can withstand temporary immersion in water (up to 1 meter for 30 minutes). IP68 means dust-tight and can withstand continuous submersion at depths specified by the manufacturer. Inovasense designs enclosures to IP65, IP67, and IP68 standards per IEC 60529.
What is Design for Manufacture (DFM)?
Design for Manufacture (DFM) is the practice of designing products to be easily and cost-effectively manufactured at scale. For electronics enclosures, this includes draft angle analysis, wall thickness optimization, snap-fit engineering, mold flow analysis, and injection molding tooling management — ensuring the final production part matches the CAD design.